Dongguan Aviation Optoelectronics Technology Co.,

Dongguan Hangjie Optoelectronics Technology Co., Ltd.

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+86 13414317108

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Industrial Electronics
7KW New Energy Vehicle Charging Pile PCBA Board Solution Development
7KW New Energy Vehicle Charging Pile PCBA Board Solution Development

7KW New Energy Vehicle Charging Pile PCBA Board Solution Development

Categories: Industrial Electronics
Product Description

It can be a challenge to find the optimal supplier for PCBs – meeting each and all customers’ expectations 

and requirements onprice, quality, lead times, value-added services, and delivery. Wonderful PCBs is

 confidant that we meet each and every expectations for your each PCB.

Production Flow

Our advantage

Material Technology

Our Production

General Production

Regular/Special

1.Our (TG170)FR4:
high quality materials, excellent heat resistance, won't distort break in high temperature, no foaming, no burning, good
performance in electrical charge, impact resistance, humidity-resistance

2.Our FR4
good performance in electrical charge, impact resistance, humidity-resistance

3.Our CEM
no-burr

4.Our Rogers
Good performance in high frequency

5.Our Aluminum
Excellent heat dispersion

1.General FR4
High heat work

2.General CEM
Expand and deform in damp conditions

Factory

We have automatic production line. The automatic production line improves the precision and efficiency of PCB producing,it makes
surface brighter, cleaner and more smooth, and it helps reduce the cost.

Artificial production line

Blind/buried via board, High Density Interconnect(1+1,N+1)

Application of HDI technology reducing the thickness and the volume of PCB boards, increasing the density of 3-D wiring design.

Difficult manufacturer, high cost

Impedance

Good performance in reliability and stability of signal sending and receiving

High cost

Surface Technics

1.IMG:smooth surface, good adhesion, no oxidation under long using
2.gold plating(thick gold:1-50U"):good wear-resistance
3.HASL:better price, not easy oxidation, easy to welding, smooth surface
4.HAL: better price, not easy oxidation, easy to welding

1.IMG:high price
2.Gold plating(thick gold):high price
3.HAL:surface is not flat, not suitable for BAG packaging

Copper Via/Surface(20-25UM,0.5-60Z)

Laser holing: Min 0.1MM, Mechanical holing: Min 0.2MM

Hard to reach 0.1MM

Multilayer board(4-20 L),BGA(CPU)

BGA:high density, high performance, multifunctional, increase thermal reliability, good performance in electroheat property, MIN
width/space: 3/3MIL

Multilayer board:strong microporous, high reliability

Difficult manufacturer,high cost

Test

To assure quality, avoid wasting after installing and scraping, save cost, save the time of rework

Careless




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Mr. Deng

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